首先感谢您选择和使用深圳市通宝TB888科技有限公司的系列LED产品。为增进您对我司产品特性的了解，也为方便您快速掌握产品的基本操作，为尽量减少或避免因人为等因素造成不必要的产品损坏，使其能够更好的为您的生产服务，特针对使用过程中的一些规范使用作相应说明，同时即使是同一规格LED，在实际应用领域其可靠性与整体系统设计水平、作业方式、使用条件均相关。本使用说明不可能涵盖客户使用过程中可能碰到的所有问题，由此带来的不便，敬请谅解！
Thanks for using our LED product. In order to enhance your understanding of our product performance, rapidly knowing well of basic operation, avoiding unnecessary product damage owing to incorrect operation, We Shenzhen HXGBRIGHT Technology Co.,Ltd, give you the following guidance of correct usage. Meanwhile, Please keep in mind that the application stable performance even for one LED is largely related to using condition, operating method, and wholly system designing level. The usage instruction is hardly possible to mention all issues occured during the usage, Hope you can understand this.
- 产品申明:使用本产品之前，请贵司务必预先进行测试，以便确认是否适合使用目的。产品介绍的用途并不保证不抵触任何专利，有关LED产品的进出口法律责任应由客户担负，请预先查清每一国家或地区的有关规定。产品可能会因性能提高或规格参数改变等缘故，恕不经预告更改。我们要求量产前签订正式的产品规格书。
1. Declaring:In order to confirm if these LEDs are suitable for your application, pretest is necessary before using it. This product presentation does not guarantee not contravene any patent. Relate to imports and exports LED product legal liability should be responsible by customer, so please verify relevant provision about the LED product in your target market. We may change specifications from time to time in the interest of product development, without prior notification or public announcement. An agreement of formal product specifications is required prior to mass production.
2、物料确认：投料的LED、BIN等级是否吻合，如VF、CIE BIN、亮度等是否属同一等级，同一等级的应在一起使用。若不是同一等级的LED应用在同一物件上，应先评估其适用性，（若不同VF投在一起可能会发生亮度上的差异，不同CIE BIN<或不同波长的LED>投在一起可能会发生色差）。
2. Before use:We suggest that the same parameters products should be used together, such as BIN coordinate, VF and luminous flux etc. Feasibility should be checked before applying to product (different VF or CIE BIN would lead to brightness and color discrepancy) to see if workable.
3、包装储存：
3.1、真空包装的储存：建议SMD系列LED存放在内置干燥剂的干燥柜中，储存环境为温度5~ 30℃，湿度≤50%，储存时间不超三个月。
3.2、拆开包装后的储存和使用：
a.拆包装前应检查包装确保无漏气，以及干燥剂无变色（正常颜色为蓝色，变成红色、粉红色代表受潮）。
b.SMD 防湿包装拆开后暴露的环境车间寿命: 在≤30℃/60%RH条件内，在线使用时间不超过72小时(Level 4)。
c.开包后的余料在≤30℃/60%RH车间环境内，应在2H内完成密封，并按照3.1条件储存。
3.3、如储存和使用不符合或超过3.1、3.2任意一条规定，应重新除潮（70℃/24小时以上）。
3.4、LED是表面贴装件，如LED受潮后水气会进入LED内部胶体中，在回流焊高温条件下，极有可能会发生LED支架和封装胶剥离拉断线材，其发光通道受到影响而导致亮度下降或发光颜色变异及死灯等异常。
3.5、LED电极和支架是由镀银的铜合金组成，外表银层易受到腐蚀性的气体影响，请避免接触腐蚀的环境造成LED变色、以免产生LED的焊接性变差或者影响光电性能。请避免环境温湿度的骤变，尤其是高湿环境下易产生水汽凝结。
3.Packaging & Storage:
3.1. Vacuum packing storage: we suggest that SMD LED series product should be put in dry cabinet. The storage temperature should be 5-30℃,humidity≤50%, and the storage period should not be exceed 3 monthes.
3.2. Storage & using after opening packaging:
a. Please check whether air slipped into packaging and drier had changed color before opening packaging(Normal color is blue while red or pink means damp.
b. After opening the packaging under the environment of ≤30℃/60%RH , LEDs should be used out in 72hours(Level 4)
c. Regarding the balance LEDs under the condition of 30℃/60%RH workshop, we should repack it within 2hours.The storage condition as per item 3.1.
3.3 You have to dehumidify all LEDs at 70℃ for more than 24 hours if do not meet requirement of item 3.1 & item 3.2.
3.4 LED is surface mounting material, it will cause cracking of the lead frame or encapsulation glue during high temperature reflow soldering if damped. Then affect the light efficiency and lead to lumen decrease, color change.
3.5 The pad of chip and lead frame are composed of copper alloy with Ag-plated. And the surface silver layer can be damaged easily by corrosive gas. So You have to keep all LEDs away from corrosive substance and environment to avoid color fade or bad welding which may result in failure of LED. Especially you have to keep all LEDs away from high temperature and high humidity environment
4. 热沉:
4.1. LED应用终端产品应重点考虑散热设计，LED功率温升系数由LED在线路板中的排布密度、热阻、和环境温度来决定。设计时LED产生的热量不超过其最大极限值（参考LED Tj结温），和其他电子元器件一样，有必要考虑避开发热元件的设计，LED正负极引脚Ts温度绝对不可超过85°！
4.2. LED发光工作时，请考虑其工作电流应该由其最大工作结温决定，并需参考温度与电流曲线进行TS温度设计和重点管控！
4. Heat Sink:
4.1. Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification.
4.2. The operating current should be decided after considering the ambient maximum temperature of LEDs.
5. 焊接条件:
5.1、产品是否适合回流焊制程请参考对应产品的规格书。通宝TB888不对浸润式的焊接方式进行质保。
5.2、回流焊焊接温度及时间请参照对应产品规格书。LED不可进行两次或以上的回流焊接。回流焊后使用过程中避免镊子等锋利工具触碰硅胶胶体部分（尤其是在LED回流焊后完全冷却前，不应该有任何外力作用于胶体和材料堆叠在一起）。
5.3、不建议将LED贴装在弯曲的线路板上。焊接时避免快速冷却，在LED焊接冷却过程中避免任何形式的机械力或过度的震动，焊接后，不要弯曲线路板。
5.4、完成焊接的LED不宜进行返修作业。如不可避免，采用加热台或双头烙铁，但事先应确认返修是否会对LED的特性产生破坏。
5. Recommended soldering
5.1. Please refer to LED specification corresponded whether the product is adaptable to reflow process. HXGBRIGHT cannot make guarantee on the LEDs after they have been assembled using the dip soldering method.
5.2. Reflow soldering temperature and time, please refer to the corresponding product specifications.LED is unfavorable for the first of two or more than two times of reflow soldering. Avoid tweezers or other sharp tools touch the silicone gel part during reflow soldering process (Cool the LEDs completely, especially after reflow soldering, there should be no external force acting on colloid and materials stacked together before cool)
5.3. Components should not be mounted on warped direction of PCB. Please avoid rapid cooling after soldering. Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp after soldering. After soldering，do not warp the PCB.
5.4. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron is suggested. It should be confirmed before handing whether the characteristics of the LEDs will not be damaged by repairing.
6. 静电防护:
LED是静电敏感电子元器件，应采取各种措施避免静电，诸如在使用过程中戴有线静电手环和防静电手套。所有的装置、设备仪器应良好的接地。建议对组装后的LED产品进行测试检查LED是否受到静电的破坏，白光或蓝光LED确认方法为（参考）：1mA或2.5V/单颗芯片不能点亮或同等条件下亮度较其他LED明显偏暗为缺陷品。
6. Protection of static electricity:
These products are sensitive to static electricity charge. Please take measures to prevent any static electricity being produced such as the wearing of a wristband or anti-static gloves when handling this product. All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment .When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test @1mA/ a dice(reference)
7. 清洁清洗:
建议使用异丙醇来清洁LED，如果要采用其他溶剂清洁，一定要确保此溶剂不会对环氧、有机硅、硅胶、支架镀银层等产生影响。不建议使用超声波清洗以免对LED造成损伤。若不可避免，清洗前请事先进行预测试，以确认是否对LED造成不良影响或潜在性隐患。
7. HXGBRIGHT suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. If have to do that, please pre-test the new method, it will avoid for bad influence or potential pitfalls.
8、其他注意事项：
8.1、白光LED是由蓝光芯片和特种荧光粉组合。因此，LED的发光颜色会随着工作电流的变化而发生变化，使用前应考虑此因素是否能达到预期效果。
8.2、砷化镓应用在某些发射管上，这类产品在废弃处理过程中禁止碎化或燃烧以免引起危害。由此类产品在废弃处理过程产生的气体或液体，吸入或饮用亦是危险的。
8.3、LED长时间暴露在阳光或偶尔暴露在紫外线下可能导致胶体或透镜黄变。
8.4、为保证LED光电性能，请保持LED发光区域表面清洁，避免手指印或其它异物覆盖。
8.5、不建议在LED的硅胶表面覆盖其它与之不兼容的脂类物质。
8.6、鉴于吸嘴的形式，除了要避免作用在硅胶表面的机械外力，对SMT贴装制程基本无限制。
8.7、请留意避免LED在组装时与其它组件发生干涉现象。
8.8、在设计电路时应预防开关过程中产生逆向电压或过大电流对LED的瞬间冲击。
8.9、SMD支架为镀银支架，银容易与硫、卤族元素发生反应，导致外观和光色发生变异，请在生产及使用环境应避免和远离硫、卤元素。
8.10、硫属于LED镀银层敏感物质。目前无参考标准，我们的建议标准为：S≤500PPM。且原材料表面不能有含硫溶液残留。
8.11、卤素建议标准：Cl≤900PPM，Br≤900PPM，Cl+Br≤1500PPM（参考IEC、IPC 标准）且原材料表面不能有含卤溶液残留。
8.12、建议客户做灯条及软灯带等产品时贴板方式采用竖贴，避免横贴造成灯珠折叠PCB时发生破损！
8.13、产品符合RoHs指令，产品意图主要应用在通用电气设备（如办公自动设备、通讯设备、视听设备、家用电器、测量工等）特别是通用照明。一旦应用在高可靠度或由于故障失效而直接影响人身安全等领域产品上（航空产品、医疗设备、动控制系统等），请事先通宝TB888的销售代表。
8. Other caution:
8.1. The White LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs.
8.2. Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned
or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed.
8.3. Long time exposure of sunlight or occasional UV exposure will cause colloid and lens discoloration.
8.4. To ensure the LED photoelectric parameters, please keep the light-emitting region surface clean. Avoiding finger print and other foreign be covered.
8.5. Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc)
8.6. When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and placenozzle, except that mechanical pressure on the surface of the resin must be prevent.
8.7. Please be aware that this product should not come into contact with other parts in assembled status.
8.8. Please design a circuit that prevents any reverse voltage (excess current) from being applied to this product instantaneously when the circuit is ON or OFF.
8.9. Surface of Lead frame is Ag-plated and elementary substance Ag easily react with sulphur and halogen material(F, CL,Br and I), which result in change of surface and color. So you have to keep LED away from those elementary substance listed above( may contained in accessories, raw material of driver and environmental materials) to avoid LED failure(Decay, color shift and failure)
8.10. Sulfide belongs LED silvering layer sensitive substances. Currently no reference standard, we recommend standards: S≤500PPM. And the raw material surface haven’t sulfide residual solution.
8.11. Halogen proposed standard: Cl≤900PPM, Br≤900PPM, Cl + Br≤1500PPM (reference IEC, IPC standards) and ahalogen-containing material surface can’t have a solution residues.
8.12. Customers are adviced to adopt vertical stick method when they produce light bar or soft light with other products. Pleasedon’t cross stick method.
8.13. This product complies with RoHs directives. This product is intended for the application in general electronic devices (such as office automation equipment, communication devices, audio-video equipment, home electrical appliances, measurement hardware and others), especially in general lighting. In cases where this product is used for the applications that requires high reliability or could directly affect human life or health due to failure or malfunction (aerospace hardware, medical equipment, atomic control equipment and others), please consult with our sales representatives beforehand. Our warranty does not cover situations where this product undergoes secondary fabrication such as changes in shape.
